Potting & Encapsulation Silicones
Explore silicone potting compounds, soft gels and clear encapsulation materials for electronic protection, filter sealing, decorative water effects and specialty tacky sheets.
Find the right material for your application, from flexible elastomers to very soft gels, with technical selection support from CREKEM.
Silicone Potting Compounds
Flexible encapsulation for electronic components and assemblies.
Silicone potting compounds cure into flexible elastomers with a more defined shape than very soft gels. Select a grade to match your assembly and production process.
Key Selection Factors
• Cured hardness and flexibility
• Mixed viscosity and filling geometry
• Working time and cure schedule
• Electrical insulation and thermal requirements
Silicone Gels
Soft materials for sensitive encapsulation, specialist sealing and transparent filling.
Silicone gels remain very soft after curing. Depending on the grade, they can provide cushioning, conformable sealing, transparent filling or a tacky contact surface. Select a material developed for the intended application.
Key Selection Factors
• Cured softness or penetration
• Clarity and surface tack
• Flow, bubble removal and cure conditions
• Substrate compatibility and application-specific performance
Find the Right Silicone for Your Application
Explore silicone materials for electronic potting, soft encapsulation, filter sealing, decorative water effects and specialty tacky sheets. Choose by application, cured consistency and processing requirements.
Condensation-Cure Silicone Potting Compounds
Transparent silicone compounds for flexible potting, sealing and component retention in electronic assemblies.
Typical Applications: Power supplies, connectors, sensors and industrial control modules.
Available Grade: CCS15 / CCS20
Mix Ratio: 1:1 by weight
Hardness: 15 ± 2 / 20 ± 2
Mixed Viscosity: 1500-2500 mPa·
Cure Time: 10–12 h at 25 °C
Transparent Silicone Potting Compounds
Transparent addition-cure silicone compounds with a choice of cured hardness for flexible electronic encapsulation.
Typical Applications: Sensors, connectors, PCB assemblies and control modules.
Available Grade: PAS10 / PAS20 / PAS30
Mix Ratio: 1:1 by weight
Hardness: Shore A 10 ± 2 / 20 ± 2 / 30 ± 2
Mixed Viscosity: 2,000–3,000 mPa·s
Color: Transparent
Black Silicone Potting Compounds
Black addition-cure silicone compounds for flexible encapsulation of electrical components and electronic assemblies.
Typical Applications: Power supplies, LED drivers, transformers and industrial electronics.
Available Grade: PAS47 / PAS55
Mix Ratio: 1:1 by weight
Hardness: Shore A 45 ± 2 / 55 ± 2
Mixed Viscosity: 2,000–6,000 mPa·s
Color: PAS47: Black; Dark Grey to Black
Clear Silicone for Water Effects
Transparent silicone encapsulation material for realistic water effects in floral arrangements, decorative displays and miniature scenes.
Typical Applications: Artificial flower arrangements, object encapsulation and model water effects.
Available Grade: WE30
Mix Ratio: 1:1 by weight
Hardness: 30± 2
Working: 100-120mins
Cure Time: 10–12 h at 25 °C
Silicone Gel
Soft silicone gel materials for sensitive electronic encapsulation and specialty tacky sheets. Select a dedicated grade for each application.
Typical Applications: Sensitive electronic assemblies, cushioning and self-adhesive gel sheets.
Available Grade: GE00 / GE05 / GE10
Mix Ratio: 1:1 by weight
Mixed Viscosity: 1,000 ± 200 mPa·s
Penetration: 200 ± 20 (0.1 mm)
Cure Time: 6–10 h at 25 °C
HF00 Filter Sealing Gel
Very soft addition-cure silicone gel for filling knife-edge sealing channels in HEPA and ULPA filter frames.
Typical Applications: HEPA and ULPA gel-seal filters and cleanroom filtration assemblies.
Available Grade: HF00
Mix Ratio: 1:1 by weight
Mixed Viscosity: 1,000 ± 200 mPa·s
Penetration: 200 ± 20 (0.1 mm)
Cure Time: 6–10 h at 25 °C
Start with what you need to protect.
Power Supplies & LED Drivers
Evaluate flow, electrical insulation and thermal requirements on the actual module.
Sensors, Connectors & Controls
Balance flexibility and component retention. Assess compatibility and thermal cycling.
Transformers & Electrical Assemblies
Qualify electrical performance at the actual fill depth and geometry.
HEPA & ULPA Filter Sealing
Validate HF00 channel filling and completed-assembly leakage.
Silicone Solutions for Your Application
Explore electronic protection, filter sealing, decorative filling and specialty gel materials.
Electronic Potting & Protection
Flexible encapsulation for power modules, sensors and electronic assemblies.
Decorative Water Effects
Clear silicone for realistic water effects in floral arrangements, decorative displays and miniature scenes.
Soft Silicone Gels
Very soft silicone materials for sensitive encapsulation, cushioning and application-specific sealing.
HEPA & ULPA Filter Sealing
Soft gel filling for knife-edge sealing channels in filter frames.
Build a repeatable potting process.
01 · Prepare
Clean and dry the assembly. Check material compatibility.
02 · Meter & Mix
Use the confirmed grade-specific ratio and mix uniformly.
03 · De-air & Fill
Validate degassing and controlled filling to reduce trapped air.
04 · Cure & Qualify
Use a validated cure schedule and inspect end-use performance.
Processing Notes: Use clean, dedicated tools for addition-cure silicones to help prevent cure inhibition. For deep or large-volume pours, confirm suitable fill depth and curing conditions with CREKEM.
Potting Encapsulation Silicone FAQs
Addition-cure silicones typically offer low cure shrinkage without releasing condensation by-products, but certain contaminants can inhibit curing. Condensation-cure silicones have different processing and compatibility requirements. Select the system using confirmed grade data and trials on your actual assembly.
Room-temperature curing is available for selected grades. Some addition-cure materials may also support heat-accelerated curing. Always follow the confirmed grade-specific mixing ratio and cure schedule, as temperature and mixed quantity can affect working time and curing.
Organotin residues, sulfur compounds, amines and incompatible rubbers, adhesives or flux residues may inhibit platinum cure. Use dedicated clean tools and run compatibility trials.
Choose a silicone potting compound when you need flexible encapsulation with a more defined cured shape. Choose a silicone gel when very soft protection and low mechanical stress are priorities. The right choice depends on the components, protection requirements and production process.
Share your application, substrates, fill depth, required softness, operating temperature and electrical or thermal requirements. CREKEM can help identify a suitable starting point and provide available technical data for evaluation. Validate the selected material on your actual assembly before production.
Bring us your application.
Share the assembly, substrates, fill depth, cure process and performance requirements to request a grade recommendation, confirmed TDS and evaluation sample.
